| 1 |
1 . Thermal packing techniques ; v. 1
Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian
Singapore : World Scientific , c2013
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| 2 |
1 . Thermal packing techniques ; v. 2
Air- and liquid-cooled cold plates / Allan Kraus
Singapore : World Scientific , c2013
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| 3 |
1 . Thermal packing techniques ; v. 3
Dielectric liquid cooling of immersed components / Karl J.L. Geisler, Avram Bar-Cohen
Singapore : World Scientific , c2013
|
| 4 |
1 . Thermal packing techniques ; v. 4
Thermoelectric microcoolers / Bao Yang, Peng Wang
Singapore : World Scientific , c2013
|
| 5 |
1 . Thermal packing techniques ; v. 5
Energy efficient solid state lighting / Mehmet Arik ... [et al.]
Singapore : World Scientific , c2013
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| 6 |
1 . Thermal packing techniques ; v. 6
Experimental thermofluid characterization of electronic components / Gary L. Solbrekken
Singapore : World Scientific , c2013
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| 7 |
set 2 . Thermal packaging tools ; v. 1
Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia ; editor-in-chief, Avram Bar-Cohen
Singapore : World Scientific , c2015
|
| 8 |
set 2 . Thermal packaging tools ; v. 2
Energy optimization and thermal management of data centers / Bahgat Sammakia ... [et al.] ; editor-in-chief, Avram Bar-Cohen
Singapore : World Scientific , c2015
|
| 9 |
set 2 . Thermal packaging tools ; v. 3
Compact thermal models of electronic components / Clemens Lasance, Mohammed-Nabil Sabry ; editor-in-chief, Avram Bar-Cohen
Singapore : World Scientific , c2015
|
| 10 |
set 2 . Thermal packaging tools ; v. 4
Thermally-informed design of microelectronic components / Ankur Srivastava ... [et al.] ; editor-in-chief, Avram Bar-Cohen
Singapore : World Scientific , c2015
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| 11 |
set 3 . Thermal packaging applications ; v. 1
Heat transfer in avionic equipment / Boris Abramzon ; editor-in-chief, Avram Bar-Cohen
: set 3. - Singapore : World Scientific , c2019
|
| 12 |
set 3 . Thermal packaging applications ; v. 2
Thermal management of RF systems / John D. Albrecht, David H. Altman, Joseph J. Maurer ; editor-in-chief, Avram Bar-Cohen
: set 3. - Singapore : World Scientific , c2019
|
| 13 |
set 3 . Thermal packaging applications ; v. 3
Phase change materials for thermal management of electronic components / Gennady Ziskind, Yoram Kozak ; editor-in-chief, Avram Bar-Cohen
: set 3. - Singapore : World Scientific , c2019
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